Samsung is constantly pushing the envelope on semiconductor technology and it's newest efforts may be truly groundbreaking. It's aiming to start mass production of silicon photonics from 2028.
This would speed up its timeline in order to catch up to TSMC which is reportedly working on similar initiatives, as Samsung aims to offer clients a turnkey solution that bundles silicon photonics with high-bandwidth memory alongside foundry and packaging solutions.
It's rushing to close the technology gap with TSMC
Silicon photonics utilize light instead of electricity to send and receive data. This should allow for dramatically faster speeds compared to the copper circuits currently used for sending and receiving data in semiconductors.
Samsung is reportedly working on secure basic silicon photonics technology and platforms by 2027, with full-scale combination alongside AI semiconductors expected to begin in 2028. NVIDIA has already demonstrated a similar product made with TSMC last year.
So it's imperative for Samsung to get a move on this as it seeks to close the technology gap with TSMC, which remains its largest rival in the semiconductor foundry segment. Samsung intends to further expand the scope of its silicon photonics technology by 2029.
The next step would involve fusing silicon photonics in a packaging chip that includes GPU and high-bandwidth memory for future AI chips. Samsung rushing to secure its position in this segment will pay dividends in the long run, as major semiconductor companies view it as a core technology for the next-generation of AI hardware.
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